General information | |
Type | CPU / Microprocessor |
Market segment | Server |
Family | |
Model number | |
CPU part numbers |
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Frequency | 2000 MHz |
Bus speed | 4.8 GT/s QPI (2400 MHz) |
Package | 1366-land Flip-Chip Land Grid Array (FC-LGA8) 1.77″ x 1.67″ (4.5 cm x 4.25 cm) |
Socket | Socket 1366 / B / LGA1366 |
Introduction date | March 30, 2009 |
End-of-Life date | Last order date for consumer processors is September 28, 2012 Last shipment date for consumer tray processors is March 27, 2015 |
Price at introduction | $224 |
S-spec numbers | |
Architecture / Microarchitecture | |
Microarchitecture | Nehalem |
Platform | Tylersburg-EP Tylersburg-EN Tylersburg-WS |
Processor core | Nehalem-EP |
Core steppings | C1 (Q1E5) D0 (Q1GM, SLBF9) |
CPUID | 106A5 (SLBF9) |
Manufacturing process | 0.045 micron 731 million transistors |
Die | 263mm2 |
Data width | 64 bit |
The number of CPU cores | 4 |
The number of threads | 4 |
Floating Point Unit | Integrated |
Level 1 cache size | 4 x 32 KB 4-way set associative instruction caches 4 x 32 KB 8-way set associative data caches |
Level 2 cache size | 4 x 256 KB 8-way set associative caches |
Level 3 cache size | 4 MB 16-way set associative shared cache |
Physical memory | 144 GB |
Multiprocessing | Up to 2 processors |
Extensions and Technologies |
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Low power features |
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Integrated peripherals / components | |
Integrated graphics | None |
Memory controller | The number of controllers: 1 Memory channels: 3 Supported memory: DDR3-800 Maximum memory bandwidth (GB/s): 19.2 ECC supported: Yes |
Other peripherals | Quick Path Interconnect (2 links) |
Electrical / Thermal parameters | |
V core | 0.75V – 1.35V |
Minimum/Maximum operating temperature | 5°C – 76°C |
Maximum power dissipation | 173.59 Watt 137.17 Watt (sustained) |
Thermal Design Power | 80 Watt |
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